Customer in Austria ordered 150 pcs etching magnesium plates

In October, Hot Sales, 150 pcs etching magnesium plates are packed for delivering to our customer in Austria. High quality etching magnesium plates with good packaging.

According to the type of metal, the etching process will be different, but the general etching process is as follows: metal etching → cleaning and skimming → drying → coating or silk printing ink → drying → exposure drawing → shampoo → etching → removing Film → dry → inspection → finished packaging.

Precautions in the etching process

1. To reduce side corrosion and protruding edges, improve the metal etching processing coefficient: the longer the general printing board is in the metal etching solution, the more serious the etching on the side. The bottom cut seriously affects the accuracy of the printing line, and the severe bottom cut will not be able to make fine lines. When the bottom cut and the edges decrease, the etching coefficient increases. The high -eclipse coefficient indicates that it can keep the thin line and make the etching line close to the size of the original image. Regardless of whether the electroplating resistant is tin -lead alloys, tin, nickel alloys or nickels, or nickel, excessively protruding edges will cause a short circuit of wires. Because the prominent edge is easy to break, a bridge is formed between the two points of the wire.

2. To increase the consistency of the etching rate between the plate and the plate: The more consistent the metal etching processing rate in the continuous plate etching, the more uniform etching items can be obtained. In order to maintain the optimal etching state during the pre -etching process, the etching solution that is easy to regenerate and compensate, and the etching rate is easy to control. Choose technology and equipment that can provide constant operation conditions and automatically control various solution parameters. It can be achieved by controlling the amount of copper, pH value, solution concentration, temperature, and uniformity of solution flow.

3. To improve the uniformity of the entire plate metal etching processing speed: The etching uniformity of the upper and lower sides of the board and the parts of the plate surface is determined by the uniformity of the meal metal etching liquid flow rate. During the etching process, the etching rate of the upper and lower panels is often inconsistent. The etching rate on the lower panel is higher than that of the upper plate. Due to the accumulation of solution on the surface of the upper plate, the etching reaction weakened. Unexplained on the upper and lower panels can be solved by adjusting the spray pressure of the upper and lower nozzles. The spray system is used to swing the nozzle, which can further improve the uniformity of the entire surface of the board by the spray pressure of the center and edge of the board.